🛠️ Career Summary
This page provides a concise summary of a technical career
that started with control theory and electromagnetic field analysis,
and expanded through semiconductor devices, MEMS, and industrial inkjet product development.
Although the fields involved are diverse, the consistent underlying principle is:
“Understanding physics, translating it into mechanisms,
and organizing it into reusable and structured forms.”
📘 Career Overview (Summary)
⚡ Control & Electromagnetic Analysis (–1997)
- Control system design using MATLAB / Simulink
- Graduate-level research in electromagnetic field analysis
- Analysis of thin-film magnetic materials and on-chip passive components
💾 Semiconductor Device Development (1997–2006)
- Process integration for logic, memory, and high-voltage CMOS
in the 0.35–0.18 µm technology generations - DRAM and PSRAM mass production ramp-up, yield improvement, and failure analysis
- Development and practical deployment of high-voltage mixed CMOS
for a-TFT driver IC applications
🎛️ Thin-Film Piezoelectric Actuators (2007–2012)
- Expansion from FeRAM PZT process evaluation
to thin-film piezoelectric actuator development - Structural analysis, reliability evaluation, and defect countermeasures
for mass-production readiness - Contribution to the foundation of Inkjet Print Head technology
🖨️ Inkjet Head Productization & Technical Education (2012– )
- Mass production deployment of Inkjet printheads,
focusing on COF driver IC implementation and electrical design - Responsibility for quality, parts management, and scheduling
from development through mass production - Development and organization-wide deployment of educational materials
covering BOM operation, ISO concepts, and technical knowledge transfer
🎯 Current Activities
- Development of structured educational content
spanning semiconductors, control systems, and inkjet technologies - Operation and maintenance of open educational resources such as
Edusemi, SemiDevKit, and EduController - Use of AI and LLMs not as replacements for design or control,
but as tools to support thinking, structuring, and design assistance
🧠 Technical Archive
This page organizes and archives the thinking frameworks applied to mass-production engineering, reliability design, and technical decision-making,
abstracted from non-public materials and structured for reproducibility and knowledge transfer.
| No. | Theme | Technology | Implementation | Business | Reproducibility | Value | Total | Document Link (Private) |
|---|---|---|---|---|---|---|---|---|
| 1 | 0.25 µm DRAM / PSRAM | 19 | 18 | 16 | 18 | 19 | 90 | 01_dram_vsram_ieee.pdf |
| 2 | 0.25 µm SRAM Macro – TiSi₂ Phase Transition Countermeasures | 19 | 19 | 17 | 17 | 18 | 90 | 02_driver-tisi2.pdf |
| 3 | Establishment of Bump Implementation on Active Devices | 17 | 18 | 15 | 16 | 18 | 84 | 03_cd50_boa.pdf |
| 4 | History of Thin-Film PZT Technology | 18 | 17 | 19 | 17 | 19 | 90 | 04_pzt_thinfilm_history.pdf |
| 5 | Reliability of Thin-Film PZT Actuators | 19 | 20 | 19 | 18 | 19 | 95 | 05_tfp_actuator_reliability.pdf |
| 6 | Driver IC Process-Migration-Type BCP (Equivalence Assurance) | 17 | 20 | 20 | 19 | 18 | 94 | 06_driver_bcp_equivalence.pdf |
| 7 | Optimization of Sequential Screening for High-Voltage Devices | 18 | 20 | 18 | 19 | 18 | 93 | 07_hv_screening_optimization.pdf |
| 8 | Cost Reduction via COF Au Plating Thickness Reduction | 16 | 19 | 20 | 18 | 17 | 90 | 08_au_plating.pdf |
| 9 | 4M Change Management for PZT / COF Bonding | 15 | 19 | 20 | 17 | 18 | 89 | 09_mach_head.pdf |
| 10 | Emergency Switching and Multi-Site Integrated 4M Management | 17 | 20 | 20 | 19 | 19 | 95 | 10_hcs_emergency_switch.pdf |
| 11 | Systematization of BOM Workflow | 16 | 19 | 19 | 20 | 20 | 94 | 11_bom_workflow.pdf |
※ Each evaluation axis represents a relative assessment on a 20-point scale, covering
“technical difficulty,” “translation into mass-production implementation,”
“business impact,” “reproducibility across other projects,” and “long-term value.”
⚠️ Note
The technical content on this page is abstracted for educational
and organizational purposes and does not represent actual manufacturing
flows, numerical conditions, or confidential information.